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AON2401 Ver la hoja de datos (PDF) - Unspecified

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AON2401
SHENZHENFREESCALE
Unspecified SHENZHENFREESCALE
AON2401 Datasheet PDF : 5 Pages
1 2 3 4 5
AON2401
8V N-Channel MOSFET
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol Parameter
Conditions
Min Typ Max Units
STATIC PARAMETERS
BVDSS Drain-Source Breakdown Voltage
ID=-250µA, VGS=0V
-8
V
IDSS
Zero Gate Voltage Drain Current
VDS=-8V, VGS=0V
TJ=55°C
-1
µA
-5
IGSS
Gate-Body leakage current
VDS=0V, VGS=±5V
±100 nA
VGS(th) Gate Threshold Voltage
VDS=VGS, ID=-250µA
-0.15 -0.4 -0.65 V
ID(ON)
On state drain current
VGS=-2.5V, VDS=-5V
-32
A
VGS=-2.5V, ID=-8A
TJ=125°C
18
22
m
24.5 32
RDS(ON) Static Drain-Source On-Resistance VGS=-1.8V, ID=-6A
22.6 28 m
VGS=-1.5V, ID=-4A
27.7 36 m
VGS=-1.2V, ID=-2A
39
53 m
gFS
Forward Transconductance
VDS=-5V, ID=-8A
33
S
VSD
Diode Forward Voltage
IS=-1A,VGS=0V
-0.55 -1
V
IS
Maximum Body-Diode Continuous Current
-4
A
DYNAMIC PARAMETERS
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Rg
Gate resistance
VGS=0V, VDS=-4V, f=1MHz
VGS=0V, VDS=0V, f=1MHz
1465
pF
345
pF
235
pF
10
SWITCHING PARAMETERS
Qg
Total Gate Charge
12.5 18 nC
Qgs
Gate Source Charge
VGS=-4.5V, VDS=-4V, ID=-8A
1.5
nC
Qgd
Gate Drain Charge
3
nC
tD(on)
Turn-On DelayTime
4
ns
tr
Turn-On Rise Time
VGS=-4.5V, VDS=-4V, RL=0.5,
28
ns
tD(off)
Turn-Off DelayTime
RGEN=3
99
ns
tf
Turn-Off Fall Time
43
ns
trr
Body Diode Reverse Recovery Time IF=-8A, dI/dt=100A/µs
23
ns
Qrr
Body Diode Reverse Recovery Charge IF=-8A, dI/dt=100A/µs
7
nC
A. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The
Power dissipation PDSM is based on R θJA t 10s value and the maximum allowed junction temperature of 150°C. The value in any given
application depends on the user's specific board design.
B. The power dissipation PD is based on TJ(MAX)=150°C, using junction-to-case thermal resistance, and is more useful in setting the upper
dissipation limit for cases where additional heatsinking is used.
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C. Ratings are based on low frequency and duty cycles to keep
initial TJ =25°C.
D. The RθJA is the sum of the thermal impedance from junction to case RθJC and case to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-case thermal impedance which is measured with the device mounted to a large heatsink, assuming
a maximum junction temperature of TJ(MAX)=150°C. The SOA curve provides a single pulse rating.
G. The maximum current rating is package limited.
H. These tests are performed with the device mounted on 1 in2 FR-4 board with 2oz. Copper, in a still air environment with TA=25°C.
2/5
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