APW7008 Ver la hoja de datos (PDF) - Anpec Electronics
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APW7008 Datasheet PDF : 21 Pages
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APW7008
Ordering and Marking Information
APW7008
Assembly Material
Handling Code
Temperature Range
Package Code
Package Code
QA : QFN3x3-16
Operating Ambient Temperature Range
I : -40 to 85 oC
Handling Code
TR : Tape & Reel
Assembly Material
G : Halogen and Lead Free Device
APW7008 QA :
APW
7008
XXXXX
XXXXX - Date Code
Note : ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish;
which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-
020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and
halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed
1500ppm by weight).
Absolute Maximum Ratings (Note 1, 2)
Symbol
Parameter
Rating
Unit
VOUT
VOUT to GND
-0.3 to +6
V
VIN
VIN to GND
VC1+, VC1-, VC2+, VC2- C1+, C1-, C2+, C2- to GND
-0.3 to +6
V
-0.3 to +6
V
VILED1-4
ILED1-4 to GND
-0.3 to +6
V
VCTRL0/1/2, VEN
CTRL0/1/2, EN to GND
-0.3 to +6
V
VISET
TJ
ISET to GND
Maximum Junction Temperature
-0.3 to 2
V
+150
°C
TSTG
Storage Temperature
-65 ~ 150
°C
TSDR
Maximum Lead Soldering Temperature, 10 Seconds
260
°C
Note 1: Stresses beyond the absolute maximum rating may damage the device and operating in the absolute maximum rating
conditions for extended periods may affect device reliability.
Note 2: The maximum allowable power dissipation at any TA (ambient temperature) is calculated using: PD(max) = (TJ – TA) /
θJA ;TJ=125°C. Exceeding the maximum allowable power dissipation will result in excessive die temperature.
Thermal Characteristics
Symbol
R θJA
Parameter
Thermal Resistance − Junction to Ambient
QFN3x3-16
Typical Value
40
Unit
°C/W
Copyright © ANPEC Electronics Corp.
2
Rev. A.3 - Feb., 2009
www.anpec.com.tw
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