APW7077 Ver la hoja de datos (PDF) - Anpec Electronics

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componentes Descripción

Lista de partido

APW7077

PWM Step-Up DC-DC Converter

Anpec Electronics 

APW7077/A

Layout Considerations (Cont.)

MINIMUM RECOMMENDED FOOTPRINT FOR SUR-

FACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the

total design. The footprint for the semiconductor pack-

ages must be the correct size to insure proper solder

connection interface between the board and the

package. With the correct pad geometry, the pack-

ages will self align when subjected to a solder reflow

process.

Bottom Layer

Demo Board Circuit Layout

1600 mil

Top Layer

Copyright © ANPEC Electronics Corp.

17

Rev. A.4 - Sep, 2005

www.anpec.com.tw

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