AS1324 Ver la hoja de datos (PDF) - austriamicrosystems AG
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AS1324 Datasheet PDF : 21 Pages
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AS1324
Datasheet - Absolute Maximum Ratings
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 3 may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in Section 6 Electrical Characteristics on page 4 is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Table 3. Absolute Maximum Ratings
Parameter
VIN to GND
SW, EN, FB to GND
Thermal Resistance ΘJA
ESD
Latch-Up
Operating Temperature Range
Storage Temperature Range
Min
Max
-0.3
6
-0.3
VIN
+ 0.3
207.4
2
-100 +100
-40
+85
-65
+125
Units
V
V
ºC/W
kV
mA
ºC
ºC
Comments
on PCB
HBM MIL-Std. 883E 3015.7 methods
JEDEC 78
Package Body Temperature
Junction Temperature
Moisture Sensitive Level
+260
125
1
The reflow peak soldering temperature (body
temperature) specified is in accordance with IPC/
JEDEC J-STD-020 “Moisture/Reflow Sensitivity
ºC
Classification for Non-Hermetic Solid State Surface
Mount Devices”.
The lead finish for Pb-free leaded packages is matte tin
(100% Sn).
Junction temperature (TJ) is calculated from the
ambient temperature (TAMB) and power dissipation
ºC (PD) as:
TJ = TAMB + (PD)(207.4ºC/W)
(EQ 1)
Represents an unlimited floor life time
www.ams.com/DC-DC_Step-Up/AS1324
Revision 1.06
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