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AS1923A-BSTT-I Ver la hoja de datos (PDF) - austriamicrosystems AG

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AS1923A-BSTT-I
AmsAG
austriamicrosystems AG AmsAG
AS1923A-BSTT-I Datasheet PDF : 17 Pages
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AS1923
Datasheet - Absolute Maximum Ratings
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 4 is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
Electrical Parameters
lid IN1, IN2 (Monitored Voltage), IN3, IN4 to GND
IN4 to GND (Device Variants M, N, O, and P, see Table 5
on page 14)
RESETN to GND
a Latchup immunity
v Continuous Power Dissipation
Continuous Power Dissipation
ill (TAMB = +70ºC)
Temperature Ranges and Storage Conditions
t Junction Temperature
Storage Temperature Range
AG t s Package Body Temperature
s en Humidity non-condensing
Technicaaml cont Moisture Sensitive Level
Min Max
-0.3 +7
-7 +0.3
-0.3 +6
696
+150
-55 +150
+260
5 85
1
Units
Comments
V
V
V
Class I Level A in accordance with EIA/JEDEC 78
mW
Derate 8.7mW/ºC above +70ºC
ºC
ºC
The reflow peak soldering temperature (body
temperature) specified is in accordance with IPC/JEDEC
ºC
J-STD-020 “Moisture/Reflow Sensitivity Classification for
Non-Hermetic Solid State Surface Mount Devices”.
The lead finish for Pb-free leaded packages is matte tin
(100% Sn).
%
Represents a max. floor life time of unlimited
www.austriamicrosystems.com/Supervisors/AS1923
Revision 1.01
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