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AS8221 Datasheet PDF : 42 Pages
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AS8221
Datasheet - Absolute Maximum Ratings
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only. Functional operation of the
device at these or any other conditions beyond those indicated in Electrical Characteristics on page 7 is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
Min
Max
Units
Notes
Battery Supply Voltage (VBAT)
-0.3
+50
V
Supply Voltage (VCC)
-0.3
+7.0
V
Supply Voltage (VIO)
-0.3
+7.0
V
DC Voltage at EN, STBN, ERRN, TxD, RxD,
TxEN, BGE, RxEN
-0.3
VIO + 0.3
V
VIO < VCC
DC Voltage on pin WAKE, INH1, INH2
DC Voltage at BP and BM
-0.3
VBAT + 0.3
-40
+50
V
Input current (latchup immunity)
-100
100
mA
According to JEDEC 78
±4
kV
BP, BM, VBAT and Wake pin according
AEC-Q100-002 (HBM)
±2
kV All other pins according to AEC-Q100-002 (HBM)
±3
Electrostatic discharge (VESD)
±500
kV
BP and BM according to FlexRay Physical Layer
EMC Measurement Specification Version 3.0
V
On all pins
AEC-Q100-011 (Charge Device Model)
±750
V
Corner pins
AEC-Q100-011 (Charge Device Model)
±100
V
AEC-Q100-003 (Machine Model)
Transient voltage on BP, BM
-200
+200
According to ISO7637 part3 test pulses a and b;
V
class C; RL=45 , CL= 100 pF;
(see Figure 18 on page 30).
-200
+200
According to ISO7637 part2 test pulses 1, 2, 3a
V
and 3b; class C; RL=45, CL= 100pF;
(see Figure 18 on page 30).
Transient voltage on VBAT
+6.5
+50
According to ISO7637 part2 test pulse 4; class C;
V
RL=45, CL= 100pF;
(see Figure 18 on page 30).
According to ISO7637 part2 test pulse 5b;
+50
class C; RL=45, CL= 100pF;
(see Figure 18 on page 30).
Total power dissipation (all supplies and outputs)
150
mW
Storage temperature
-55
+150
ºC
Junction temperature
-40
+150
ºC
Package body temperature
The reflow peak soldering temperature (body
temperature) specified is in accordance with IPC/
JEDEC J-STD-020 “Moisture/Reflow Sensitivity
260
ºC
Classification for Non-Hermetic Solid State
Surface Mount Devices”.
The lead finish for Pb-free leaded packages is
matte tin (100% Sn).
Humidity non-condensing
5
85
%
Moisture Sensitivity Level
3
Represents a maximum floor life time of 168h
www.austriamicrosystems.com/flexray/AS8221
Revision 1.7
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