S1Q Ver la hoja de datos (PDF) - Micro Commercial Components
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S1Q Datasheet PDF : 1 Pages
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MCC
omponents
21201 Itasca Street Chatsworth
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S1Q
THRU
S1ZZ
Features
• For Surface Mount Applications
• Extremely Low Thermal Resistance
• High Temp Soldering: 250°C for 10 Seconds At Terminals
• Easy Pick And Place
• Gull Wing Lead Bend To Prevent Arcing
• Perfect For Ballast, Television And Monitor Applications
Maximum Ratings
• Operating Temperature: -55°C to +150°C
• Storage Temperature: -55°C to +150°C
• Maximum Thermal Resistance; 15°C/W Junction To Lead
MCC
Maximum Maximum Maximum
Part
Device
Recurrent
RMS
DC
Number Marking Peak Reverse Voltage Blocking
Voltage
Voltage
S1Q
S1Q
1200V
840V
1200V
S1V
S1V
1400V
980V
1400V
S1Y
S1Y
1600V
1120V
1600V
S1Z
S1Z
1800V
1260V
1800V
S1ZZ
S1ZZ
2000V
1400V
2000V
lectrical Characteristics @ 25°C Unless Otherwise Specified
Average Forward
Current
IF(AV)
1.0A TJ = 75°C
Peak Forward Surge
IFSM
Current
30A 8.3ms, half sine
Maximum
Instantaneous
Forward Voltage
VF
1.10V IFM = 1.0A;
TJ = 25°C*
Maximum DC
Reverse Current At
Rated DC Blocking
Voltage
IR
10.0µA TJ = 25°C
30µA TJ = 125°C
Maximum Reverse
Recovery Time
Trr
1.8u s IF=0.5A, IR=1.0A,
Irr=0.25A
Typical Junction
Capacitance
CJ
15pF Measured at
1.0MHz, VR=4.0V
*Pulse test: Pulse width 300 µsec, Duty cycle 2%
1 Amp
Silicon Rectifier
1200 to 2000 Volts
DO-214AA
(SMBJ) (Round Lead)
H
Cathode Band
J
A
C
E
F
G
D
B
DIMENSIONS
INCHES
DIM
MIN
MAX
A
.078
.116
B
.075
.089
C
.002
.008
D
-----
.02
E
.035
.055
F
.065
.091
G
.205
.224
H
.160
.180
J
.130
.155
MM
MIN
1.98
1.90
.05
-----
.90
1.65
5.21
4.06
3.30
MAX
2.95
2.25
.20
.51
1.40
2.32
5.69
4.57
3.94
SUGGESTED SOLDER
PAD LAYOUT
0.090"
NOTE
0.085”
0.070”
www.mccsemi.com
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