BAL-2690D3U Ver la hoja de datos (PDF) - STMicroelectronics
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BAL-2690D3U Datasheet PDF : 8 Pages
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Package information
BAL-2690D3U
Figure 12. Footprint
Copper pad diameter:
220 µm recommended
Solder mask opening
300 µm minimum
Solder stencil opening:
220 µm recommended
Figure 13. Marking
Dot, ST logo
ECOPACK® Grade
xx = marking
z = manufacturing location
yww = datecode
(y = year
ww = week)
xxz
y ww
Figure 14. Flip-Chip - tape and reel specification
Dot identifying pin A1 location
0.20 ± 0.015
2.0 ± 0.05
4.0 ± 0.1
Ø 1.50 ± 0.10
Note:
0.73± 0.05
1.0 ± 0.05
2.0 ± 0.05
All dimensions in mm
User direction of unreeling
More packing information is available in the applications note:
AN 2348: “Flip-Chip: package description and recommendations for use”
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Doc ID 16056 Rev 2
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