BAP51-04W Ver la hoja de datos (PDF) - NXP Semiconductors.
Número de pieza
componentes Descripción
Lista de partido
BAP51-04W Datasheet PDF : 7 Pages
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Philips Semiconductors
General purpose PIN diode
PACKAGE OUTLINE
Plastic surface mounted package; 3 leads
D
B
Preliminary specification
BAP51-04W
SOT323
E
A
X
y
3
1
e1
bp
e
2
wM B
HE
vM A
A
A1
Q
c
Lp
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT A
A1
max
bp
c
D
E
e
e1 HE Lp
Q
v
w
mm
1.1
0.8
0.1
0.4
0.3
0.25 2.2
0.10 1.8
1.35
1.15
1.3
0.65
2.2
2.0
0.45 0.23
0.15 0.13
0.2
0.2
OUTLINE
VERSION
IEC
SOT323
2002 Feb 19
REFERENCES
JEDEC
EIAJ
SC-70
5
EUROPEAN
PROJECTION
ISSUE DATE
97-02-28
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