BDT61 Ver la hoja de datos (PDF) - Power Innovations Ltd

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BDT61

NPN SILICON POWER DARLINGTONS

Power Innovations Ltd 

BDT61, BDT61A, BDT61B, BDT61C

NPN SILICON POWER DARLINGTONS

AUGUST 1993 - REVISED MARCH 1997

MECHANICAL DATA

TO-220

3-pin plastic flange-mount package

This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic

compound. The compound will withstand soldering temperature with no deformation, and circuit performance

characteristics will remain stable when operated in high humidity conditions. Leads require no additional

cleaning or processing when used in soldered assembly.

TO220

ø

3,96

3,71

10,4

10,0

2,95

2,54

see Note B

4,70

4,20

1,32

1,23

6,6

6,0

15,90

14,55

see Note C

6,1

3,5

0,97

0,61

123

1,70

1,07

2,74

2,34

5,28

4,88

14,1

12,7

0,64

0,41

2,90

2,40

VERSION 1

ALL LINEAR DIMENSIONS IN MILLIMETERS

NOTES: A. The centre pin is in electrical contact with the mounting tab.

B. Mounting tab corner profile according to package version.

C. Typical fixing hole centre stand off height according to package version.

Version 1, 18.0 mm. Version 2, 17.6 mm.

VERSION 2

PRODUCT INFORMATION

MDXXBE

5

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