HUF76407DK8T Ver la hoja de datos (PDF) - Intersil

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HUF76407DK8T

3.5A, 60V, 0.105 Ohm, Dual N-Channel, Logic Level UltraFET Power MOSFET

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HUF76407DK8

The transient thermal impedance (ZθJA) is also effected by

varied top copper board area. Figure 24 shows the effect of

copper pad area on single pulse transient thermal

impedance. Each trace represents a copper pad area in

square inches corresponding to the descending list in the

graph. Spice and SABER thermal models are provided for

each of the listed pad areas.

Copper pad area has no perceivable effect on transient

thermal impedance for pulse widths less than 100ms. For

pulse widths less than 100ms the transient thermal

impedance is determined by the die and package. Therefore,

CTHERM1 through CTHERM5 and RTHERM1 through

RTHERM5 remain constant for each of the thermal models. A

listing of the model component values is available in Table 1.

160

COPPER BOARD AREA - DESCENDING ORDER

0.020 in2

0.140 in2

120 0.257 in2

0.380 in2

0.493 in2

80

40

0

10-1

100

101

102

103

t, RECTANGULAR PULSE DURATION (s)

FIGURE 24. THERMAL RESISTANCE vs MOUNTING PAD AREA

8

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