CGA-6618 Ver la hoja de datos (PDF) - RF Micro Devices

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CGA-6618

DUAL CATV 1MHz to 1000MHz HIGH LINEARITY GaAs HBT AMPLIFIER

RF Micro Devices 

CGA-6618(Z)

Pin

1

2, 3,

6, 7

4

5

8

EPAD

Function

RF IN

GND

Description

Device 1. RF input pin. This pin requires the use of an external DC-blocking capacitor as shown in the schematic.

Connection to ground. Use via holes for best performance to reduce lead inductance as close to ground leads as

possible.

RF IN

RF OUT/VCC

RF OUT/VCC

GND

Device 2. RF input pin. This pin requires the use of an external DC-blocking capacitor as shown in the schematic.

Device 2. RF output and bias pin. Bias should be supplied to this pin through an external series resistor and RF

choke inductor. Because DC biasing is present on this pin, a DC-blocking capacitor should be used in most appli-

cations. The supply side of the bias network should be well bypassed.

Device 1. Same as pin 5.

Exposed area on the bottom side of the package must be soldered to the ground plane of the board for optimum

thermal and RF performance. Several vias should be located under the EPAD as shown in the recommended

land pattern.

Suggested Pad Layout

PCB Pad Layout

Dimensions in inches [millimeters]

Sized for 31 mil thick FR-4

TOP VIEW

8

7

6

5

Package Drawing and Marking

Dimensions in inches (millimeters)

Refer to drawing posted at www.rfmd.com for tolerances.

BOTTOM VIEW

PACKAGE TYPE:

ESOP-8

Lot Code

CGA6618 .155 [3.937] .236 [5.994]

1234

.061 [1.549]

.112

[2.85]

.194 [4.93]

.088 [2.25]

EXPOSED PAD

.050 [1.27]

.016 [.406]

.061 [1.549]

.008 [.203]

.058 [1.473] .013 [.33] x 45°

DETAIL A

.008

PARTING LINE

.194 [4.928]

SIDE VIEW

.003 [.076]

SEATING PLANE

SEE DETAIL A

.155 [3.937]

END VIEW

.025

5°

EDS-101993 Rev L

7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical

support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.

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