CM3002 Ver la hoja de datos (PDF) - California Micro Devices Corp
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CM3002 Datasheet PDF : 17 Pages
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CM3002
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
ESD Protection (HBM)
Pin Voltages
VCC
EN
VOUT
Storage Temperature Range
Operating Temperature Range
Ambient
Junction
Power Dissipation (Note 1)
RATING
+2000
[GND - 0.4] to [+6.0]
[GND - 0.4] to [+6.0]
[GND - 0.4] to [+6.0]
-40 to +150
0 to +70
0 to +150
Internally Limited
UNITS
V
V
V
V
°C
°C
°C
W
Note 1: The SOIC and MSOP packages are thermally enhanced through the use of a fused integral leadframe. The power rating is
based on a printed circuit board heat spreading capability equivalent to 2 square inches of copper connected to the GND
pins. Typical multi-layer boards using power plane construction will provide this heat spreading ability without the need for
additional dedicated copper area. Please consult with factory for thermal evaluation assistance.
STANDARD OPERATING CONDITIONS
PARAMETER
VCC (CM3002-15SA, CM3002-18SA, CM3002-25SA)
VCC (CM3002-33SA, CM3002-33MA)
Ambient Operating Temperature Range
Load Current
CEXT
RATING
3.0 to 3.6
3.0 to 5.5
0 to +70
0 to +1000
10 +20%
UNITS
V
V
°C
mA
µF
© 2004 California Micro Devices Corp. All rights reserved.
08/16/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com 3
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