CPC5712 Ver la hoja de datos (PDF) - Clare Inc => IXYS
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Lista de partido
CPC5712 Datasheet PDF : 11 Pages
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CPC5712
4. Manufacturing Information
4.1 Mechanical Dimensions and Printed Circuit Board Land Pattern
16-Lead SOP Package
4.902 ± 0.102
(0.193 ± 0.004)
0.254 MAX - 0.178 MIN
(0.010 MAX - 0.007 MIN)
3.812 ± 0.076
(0.150 ± 0.003)
0.712 ± 0.051
(0.028 ± 0.002)
6.045 ± 0.153
(0.238 ± 0.006)
PIN 1
0.635
(0.025)
0.254 ± 0.051
(0.010 ± 0.002)
0.051 MIN, 0.305 MAX
(0.002 MIN, 0.012 MAX)
1.447 ± 0.076
(0.057 ± 0.003)
0.762 MAX - 0.508 MIN
(0.030 MAX - 0.020 MIN)
1.829 MAX
(0.072 MAX)
Recommended PCB Land Pattern
5.40
(0.213)
1.55
(0.061)
0.635
(0.025)
0.40
(0.0157)
Dimensions
mm
(inches)
4.2 Tape and Reel Packaging
Tape and Reel Packaging for 16-Lead SOP Package
330.2 DIA.
(13.00 DIA.)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
Embossed Carrier
Embossment
Top Cover
Tape
K0= 2.10 ± 0.10
(0.083 ± 0.004)
W = 12.00 ± 0.30
(0.472 ± 0.012)
B0 = 5.30 ± 0.10
(0.209 ± 0.004)
P = 8.00 ± 0.10
(0.315 ± 0.004)
A
0
=
6.50
±
0.10
(0.256 ± 0.004)
User Direction of Feed
Dimensions
mm
(inches)
NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2
10
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