CXK5T8257BTM Ver la hoja de datos (PDF) - Sony Semiconductor
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CXK5T8257BTM Datasheet PDF : 10 Pages
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Package Outline
Unit: mm
CXK5T8257BTM
28PIN TSOP (Plastic)
∗8.0 ± 0.1
21
8
1.2 MAX
0.1
CXK5T8257BTM/BYM/BM
22
28 1
+ 0.1
0.2 – 0.05
7
0.55 ± 0.1
A
+ 0.07
0.127 – 0.02
+ 0.1
0.05 – 0.05
CXK5T8257BYM
0° to 10°
NOTE: Dimension “∗” does not include mold protrusion.
DETAIL A
SONY CODE
EIAJ CODE
JEDEC CODE
TSOP-28P-L01
TSOP028-P-0000-A
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE WEIGHT
EPOXY RESIN
SOLDER PLATING
COPPER / 42 ALLOY
0.2g
28PIN TSOP (Plastic)
∗8.0 ± 0.1
1.2 MAX
8
21
0.1
7
1 28
+ 0.1
0.2 – 0.05
22
0.55 ± 0.1
A
+ 0.07
0.127 – 0.02
+ 0.1
0.05 – 0.05
0° to 10°
NOTE: Dimension “∗” does not include mold protrusion.
DETAIL A
SONY CODE
EIAJ CODE
JEDEC CODE
TSOP-28P-L01R
TSOP028-P-0000-B
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
EPOXY RESIN
SOLDER PLATING
COPPER / 42 ALLOY
PACKAGE WEIGHT
0.2g
–9–
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