CY7C1326F Ver la hoja de datos (PDF) - Cypress Semiconductor

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componentes Descripción

Lista de partido

CY7C1326F

2-Mb (128K x 18) Pipelined Sync SRAM

Cypress Semiconductor 

Thermal Resistance[10]

Parameter

ΘJA

ΘJC

Description

Thermal Resistance

(Junction to Ambient)

Thermal Resistance

(Junction to Case)

CY7C1326F

Test Conditions

Test conditions follow standard test methods

and procedures for measuring thermal imped-

ance, per EIA/JESD51

TQFP

Package

41.83

9.99

Unit

°C/W

°C/W

Capacitance[10]

Parameter

CIN

CCLK

CI/O

Description

Input Capacitance

Clock Input Capacitance

Input/Output Capacitance

AC Test Loads and Waveforms

Test Conditions

TA = 25°C, f = 1 MHz,

VDD = 3.3V.

VDDQ = 3.3V

Max. Unit

5 pF

5 pF

5 pF

3.3V I/O Test Load

OUTPUT

Z0 = 50Ω

3.3V

OUTPUT

RL = 50Ω

5 pF

VL = 1.5V

(a)

INCLUDING

JIG AND

SCOPE

R = 317Ω

R = 351Ω

(b)

VDD

GND

ALL INPUT PULSES

10%

90%

≤ 1 ns

90%

10%

≤ 1 ns

(c)

Note:

10. Tested initially and after any design or process change that may affect these parameters.

Document #: 38-05424 Rev. **

Page 8 of 15

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