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DS32KHZ Ver la hoja de datos (PDF) - Dallas Semiconductor -> Maxim Integrated

Número de pieza
componentes Descripción
Lista de partido
DS32KHZ
Dallas
Dallas Semiconductor -> Maxim Integrated Dallas
DS32KHZ Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
RELATED APPLICATION NOTES
(Go to www.maxim-ic.com/RTCapps to find these application notes and more.)
Application Note 58: Crystal Considerations with Dallas Real-Time Clocks
Application Note 701: Using the DS32kHz with Dallas RTCs
DS32kHz
HANDLING, PC BOARD LAYOUT, AND ASSEMBLY
These packages contain a quartz tuning-fork crystal. Pick-and-place equipment may be used, but precautions
should be taken to ensure that excessive shocks are avoided. Ultrasonic cleaning should be avoided to prevent
damage to the crystal.
Avoid running signal traces under the package, unless a ground plane is placed between the package and the
signal line. All N.C. (no connect) pins must be connected to ground.
The BGA package may be reflowed as long as the peak temperature does not exceed +225°C. Peak reflow
temperature (220°C) duration should not exceed 10 seconds, and the total time above 200°C should not exceed
40 seconds (30 seconds nominal). For the SO package, refer to the IPC/JEDEC J-STD-020 specification for reflow
profiles. Exposure to reflow is limited to 2 times maximum. The DIP package can be wave-soldered, provided that
the internal crystal is not exposed to temperatures above +150°C.
Moisture sensitive packages are shipped from the factory dry-packed. Handling instructions listed on the package
label must be followed to prevent damage during reflow. Refer to the IPC/JEDEC J-STD-020 standard for moisture-
sensitive device (MSD) classifications.
THERMAL INFORMATION
PACKAGE TYPE
16-pin SO (300 mils)
36-pin BGA
THETA-JA
(°C/W)
73
43.9
THETA-JC
(°C/W)
23
18.4
PACKAGE INFORMATION
(For the latest package information, go to www.maxim-ic.com/DallasPackInfo.)
PACKAGE TYPE
DOCUMENT NO.
14-pin Encapsulated DIP
16-pin SO (300 mils)
36-pin BGA
56-G0001-002
56-G4009-001
56-G6023-001
8 of 8
Maxim/Dallas Semiconductor cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim/Dallas Semiconductor product.
No circuit patent licenses are implied. Maxim/Dallas Semiconductor reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2007 Maxim Integrated Products
The Maxim logo is a registered trademark of Maxim Integrated Products, Inc. The Dallas logo is a registered trademark of Dallas Semiconductor Corporation.

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