CY7C265(2006) Ver la hoja de datos (PDF) - Cypress Semiconductor
Número de pieza
componentes Descripción
Lista de partido
CY7C265 Datasheet PDF : 13 Pages
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CY7C265
Package Diagrams (continued)
Figure 4. 28-Lead (300-Mil) Molded DIP P21
14
15
0.140[3.55]
0.190[4.82]
0.115[2.92]
0.160[4.06]
0.090[2.28]
0.110[2.79]
28-Lead (300-Mil) PDIP P21
SEE LEAD END OPTION
1
0.260[6.60]
0.295[7.49]
DIMENSIONS IN INCHES [MM] MIN.
MAX.
REFERENCE JEDEC MO-095
PACKAGE WEIGHT: 2.15 gms
1.345[34.16]
1.385[35.18]
0.055[1.39]
0.065[1.65]
LEAD END OPTION
(LEAD #1, 14, 15 & 28)
28
0.030[0.76]
0.080[2.03]
SEATING PLANE
0.015[0.38]
0.020[0.50]
0.120[3.05]
0.140[3.55]
0.015[0.38]
0.060[1.52]
0.009[0.23]
0.012[0.30]
SEE LEAD END OPTION
0.290[7.36]
0.325[8.25]
0.310[7.87]
0.385[9.78]
3° MIN.
51-85014-*D
Document #: 38-04012 Rev. *B
Page 11 of 13
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