DME1737 Ver la hoja de datos (PDF) - SMSC -> Microchip
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Lista de partido
DME1737 Datasheet PDF : 5 Pages
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Package Outline
Figure 2 128 Pin QFP Package Outline, 14X20X2.7 Body, 3.2 mm Footprint
Table 1 128 Pin QFP Package Parameters
MIN
NOMINAL
MAX
A
~
~
3.4
A1
0.05
~
0.5
A2
2.55
~
3.05
D
23.00
23.20
23.40
D1
19.90
20.00
20.10
E
17.00
17.20
17.40
E1
13.90
14.00
14.10
H
0.09
~
0.20
L
0.73
0.88
1.03
L1
~
1.60
~
e
0.50 Basic
q
0o
~
7o
W
0.10
~
0.30
R1
0.08
~
~
R2
0.08
~
0.30
ccc
~
~
0.08
REMARKS
Overall Package Height
Standoff
Body Thickness
X Span
X body Size
Y Span
Y body Size
Lead Frame Thickness
Lead Foot Length
Lead Length
Lead Pitch
Lead Foot Angle
Lead Width
Lead Shoulder Radius
Lead Foot Radius
Coplanarity
Notes:
1. Controlling Unit: millimeter.
2. Controlling Unit: millimeter.
3. Tolerance on the position of the leads is ± 0.04 mm maximum.
4. Package body dimensions D1 and E1 do not include the mold protrusion.
5. Maximum mold protrusion is 0.25 mm.
6. Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
7. Details of pin 1 identifier are optional but must be located within the zone indicated.
SMSC DME1737
5
PRODUCT PREVIEW
Rev. 05-21-04
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