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DS1083L Ver la hoja de datos (PDF) - Maxim Integrated

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DS1083L Datasheet PDF : 5 Pages
1 2 3 4 5
16MHz to 134MHz Spread-Spectrum
Clock Modulator for LCD Panels
Pin Description
PIN
NAME
DESCRIPTION
1
CLKIN Clock Input. 16MHz to 134MHz clock input (fIN).
2
GND Ground
3
SSO
Spread-Spectrum Clock Output. Outputs a center-dithered spread-spectrum version of the clock input at
CLKIN.
Spread-Spectrum Magnitude Select Inputs. These digital inputs select the desired spread-spectrum
4
SMSEL2 magnitude as shown in the table below. Both inputs contain pullup resistors (RPU) to VCC.
SMSEL2
SMSEL1
MAGNITUDE SELECTED (%)
0
0
±2
0
5
SMSEL1
1
1
±1.5
0
±1
1
1
±0.5
6
VCC Supply Voltage
Detailed Description
The DS1083L modulates an input clock to provide a cen-
ter-dithered spread-spectrum output. A 16MHz to
134MHz clock is applied to the CLKIN pin. The PLL
dithers the output clock about its center frequency at a
user-selectable magnitude. The user is required to cycle
power to the device each time there is a change in the
input frequency, for the PLL to lock correctly. This
ensures proper output frequency and dither rate. The
desired spread-spectrum magnitude is selected using
input pins SMSEL1 and SMSEL2 (see the Pin Description
for details). The DS1083L is capable of generating
spread-spectrum clocks from 16MHz to 134MHz.
Dither-Rate Selection
The output spread-spectrum dither rate is automatically
adjusted depending on the input frequency, to maxi-
mize EMI reduction.
The dither cycle rate is:
fIN/512, if fIN is between 16MHz and 33MHz
fIN/1024, if fIN is between 33MHz and 64MHz
fIN/2048, if fIN is between 64MHz and 134MHz
On power-up, the output clock (SSO) remains three-
stated until it reaches a stable frequency (fSSO). The
dither rate is selected by sampling the input clock at
power-up.
Applications Information
Power-Supply Decoupling
To achieve best results, it is highly recommended that a
decoupling capacitor is used on the IC power-supply
pins. Typical values of decoupling capacitors are
0.01µF and 0.1µF. Use a high-quality, ceramic, surface-
mount capacitor, and mount it as close as possible to
the VCC and GND pins of the IC to minimize lead
inductance.
Chip Information
SUBSTRATE CONNECTED TO GROUND
4 _______________________________________________________________________________________

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