FDMS3016DC Ver la hoja de datos (PDF) - Fairchild Semiconductor
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Lista de partido
FDMS3016DC Datasheet PDF : 2 Pages
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1-Phase CCM with Heat Sink and Forced Air 200LFM
Top
120.00
100.00
80.00
Dual Cool Package
60.00
40.00
20.00
Dual Cool Package
3.3mm x 3.3mm
PQFN
3.3mm x 3.3mm
0.00
1
5 10 15 20 25 30 35
Load (A)
Competitor Package
Dual Cool Package
3.3mm x 3.3mm
Competitor
Board
Solderable Component
Area
4.5mm2
3mm2
% Difference
Solderable Area
The new
standard
33% less
DirectFET
Total
Component Area (Max)
11.56mm2
19.16mm2
5mm x 6mm Package
Product Number
SyncFET™
Technology
BVDSS
VGS
FDMS8570SDC
Y
25
20
FDMS7650DC
N
30
20
FDMS3006SDC
Y
30
20
FDMS3008SDC
Y
30
20
FDMS3016DC
N
30
20
FDMS8320LDC
N
40
20
FDMS86500DC
N
60
20
FDMS86300DC
N
80
20
FDMS86101DC
N
100
20
FDMS86200DC
N
150
20
10V
2.8
0.99
1.9
2.6
6
1.1
2.3
3.1
7.5
17
RDS(ON) Max (m)
8V
6V
-
-
-
-
-
-
-
-
-
-
-
-
3.3
-
4
-
-
12
-
25
4.5V
3.3
1.55
2.7
3.3
9
1.5
-
-
-
-
3.3mm x 3.3mm Package
Product Number
SyncFET
Technology
BVDSS
VGS
10V
RDS(ON) Max (m)
8V
6V
FDMC7660DC
N
30
20
-
-
-
FDMC86520DC
N
60
20
6.3
8.7
-
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information, please see: www.fairchildsemi.com/legal
Lit. No. 100027-004 © 2013 Fairchild Semiconductor. All Rights Reserved.
4.5V
-
-
Bottom
Qg
Qgd
(nC)
(nC)
22
4.4
42
9.7
26
5.3
21
4.3
7.6
2.5
57
16
76
15
72
14
31
7
30
5.6
Qg
Qgd
(nC)
(nC)
-
-
29
5.5
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