FM24C128 Ver la hoja de datos (PDF) - Fairchild Semiconductor

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FM24C128

128K-Bit Standard 2-Wire Bus Interface Serial EEPROM

Fairchild Semiconductor 

Physical Dimensions inches (millimeters) unless otherwise noted

0.019 MAX.

0.014 MIN.

0.325 MAX.

0.305 MIN.

0.050 BSC

2.

0.206 ± 0.004

1.

0.206 ± 0.004

0.0098 MAX.

0.0020 MIN.

0.80 MAX.

NOTE :

1. DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.

MOLD FLASH, PROTRUSIONS AND GATE BURRS SHALL NOT

EXCEED 0.006 INCH PER SIDE

2. DOES NOT INCLUDE INTER-LEAD FLASH OR PROTRUSIONS.

INTER-LEAD FLASH AND PROTRUSIONS SHALL NOT

EXCEED 0.010 INCH PER SIDE.

3. THIS PART IS COMPLIANT WITH EIAJ SPECIFICATION ED-7402-1.

4. LEAD SPAN/STAND OFF HEIGHT/COPLANARITY ARE CONSIDERED

AS SPECIAL CHARACTERISTIC.(S)

+0.0015

-0.0005

0.008

LEADFRAME THICKNESS

0.030 MAX.

0.020 MIN.

7° REF ALL SIDE.

2.

0.208 ± 0.004

8-Pin Molded Small Outline Package (MW8)

Package Number M08D

0.032 ± 0.002

0° - 8°

0.114 - 0.122

(2.90 - 3.10)

8

5

0.246 - 0.256

(6.25 - 6.5)

0.123 - 0.128

(3.13 - 3.30)

1

0.169 - 0.177

(4.30 - 4.50)

4

Pin #1 IDENT

(4.16) Typ (7.72) Typ

(1.78) Typ

(0.42) Typ

(0.65) Typ

Land pattern recommendation

0.0433

(1.1)

Max

0.0256 (0.65)

Typ.

0.002 - 0.006

(0.05 - 0.15)

See detail A

0.0035 - 0.0079

0.0075 - 0.0118

(0.19 - 0.30)

0°-8°

DETAIL A

Typ. Scale: 40X

0.020 - 0.028

(0.50 - 0.70)

Gage

plane

Seating

plane

0.0075 - 0.0098

(0.19 - 0.25)

Notes: Unless otherwise specified

1. Reference JEDEC registration MO153. Variation AA. Dated 7/93

8-Lead Molded Thin Shrink Small Outline Package (MT8)

Package Number MTC08

FM24C128 Rev. D

12

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