FM25V20 Ver la hoja de datos (PDF) - Cypress Semiconductor

Número de pieza

componentes Descripción

Lista de partido

FM25V20

2Mb Serial 3V F-RAM Memory

Cypress Semiconductor 

Mechanical Drawing

8-pin TDFN* (5.0 mm x 6.0 mm body, 1.27 mm pad pitch)

5.0 BSC

FM25V20 – 2Mb SPI F-RAM

Exposed metal pad

should be left floating.

Pin 1 ID

Pin 1

0.75 ±0.05

1.27

0.40 ±0.05

0.0 - 0.05

3.81 REF

0.60 ±0.05

0.20 REF.

Recommended PCB Footprint

1.4

6.80

Silkscreen

Pin 1

1.27

0.60

Note: All dimensions in millimeters. This package is footprint compatible with the 8-pin SOIC.

The exposed pad should be left floating.

TDFN Package Marking Scheme for Body Size 5.0mm x 6.0mm

RGXXXXT

LLLL

YYWW

Legend:

R=Ramtron, G=”green” TDFN package

XXXX=base part number, T=temperature (blank=ind., C=comm.)

LLLL= lot code

YY=year, WW=work week

Example: “Green” TDFN package, FM25V20, Lot 0012, Year 2010, Work Week 29

RG5V20

0012

1029

Rev. 3.0

August 2012

Page 14 of 17

Share Link: