ML63189B-XXX Ver la hoja de datos (PDF) - Oki Electric Industry

Número de pieza

componentes Descripción

Lista de partido

ML63189B-XXX

ML63187-xxx

Oki Electric Industry 

¡ Semiconductor

PAD CONFIGURATION (ML63189B)

Pad Layout

ML63187/63189B

VDDI 93

PE.0 94

PE.1 95

PE.2 96

PE.3 97

PB.0 98

PB.1 99

PB.2 100

PB.3 101

PA.0 102

PA.1 103

PA.2 104

PA.3 105

P9.0 106

P9.1 107

P9.2 108

P9.3 109

P0.0 110

P0.1 111

P0.2 112

P0.3 113

COM1 114

COM2 115

COM3 116

COM4 117

COM5 118

COM6 119

COM7 120

COM8 121

SEG0 122

SEG1 123

ML63189B

62 SEG63

61 SEG62

60 SEG61

59 SEG60

58 SEG59

57 SEG58

56 SEG57

55 SEG56

54 SEG55

53 SEG54

52 SEG53

51 SEG52

50 SEG51

49 SEG50

48 SEG49

47 SEG48

46 SEG47

45 SEG46

44 SEG45

43 SEG44

42 SEG43

41 SEG42

40 SEG41

39 SEG40

38 SEG39

37 SEG38

36 SEG37

35 SEG36

34 SEG35

33 SEG34

32 SEG33

31 SEG32

Y

X

Chip size

Chip thickness

Coordinate origin

Pad hole size

Pad size

Minimum pad pitch

: 4.81 mm ¥ 5.20 mm

: 350 mm (280 mm: available as required)

: center of chip

: 100 mm ¥ 100 mm

: 110 mm ¥ 110 mm

: 140 mm

Note: The chip substrate voltage is VSS.

10/35

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