GP1S092HCPIF Ver la hoja de datos (PDF) - Sharp Electronics

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GP1S092HCPIF

SMT, Gap : 2mm, Slit : 0.3mm Phototransistor Output, Compact Transmissive Photointerrupter

Sharp Electronics 

● Soldering Method

Reflow Soldering:

Reflow soldering should follow the temperature profile shown below.

Soldering should not exceed the curve of temperature profile and time.

Please solder within one time.

MAX

240˚C

200˚C

1 to 4˚C/s

MAX

160˚C

GP1S092HCPIF

1 to 4˚C/s

1 to 4˚C/s

25˚C

MAX10s

MAX120s

MAX60s

MAX90s

Hand soldering

Hand soldering should be completed within 3 s when the point of solder iron is below 350̊C.

Please solder within one time.

Please don't touch the terminals directly by soldering iron.

Soldered product shall treat at normal temperature.

Other notice

Please take care not to let any external force exert on lead pins.

Please test the soldering method in actual condition and make sure the soldering works fine, since the

impact on the junction between the device and PCB varies depending on the cooling and soldering

conditions.

Lead terminals

Lead terminals of this product are tin copper alloy plated. Before usage, please evaluate solderability with

actual conditions and confirm. And the uniformity in color for the lead terminals are not specified.

Sheet No.: D3-A00201EN

9

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