HDMIULC6-4F3 Ver la hoja de datos (PDF) - STMicroelectronics
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HDMIULC6-4F3 Datasheet PDF : 9 Pages
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Package information
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Package information
HDMIULC6-4F3
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 11. Package dimensions
400 µm
200 µm
255 µm
605 µm ±55
1600 µm ±40
Figure 12. Footprint recommendations Figure 13. Marking
Copper pad Diameter:
220 µm recommended
260 µm maximum
Solder mask opening:
300 µm minimum
Solder stencil opening:
220 µm recommended
Dot, ST logo
ECOPACK® grade
xx = marking
z = manufacturing location
yww = datecode
(y = year
ww = week)
xxz
y ww
6/9
Doc ID 15511 Rev 3
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