HPL5331KC-TR Ver la hoja de datos (PDF) - Unspecified
Número de pieza
componentes Descripción
Lista de partido
HPL5331KC-TR Datasheet PDF : 20 Pages
| |||
HPL5331
Carrier Tape
Application A
SOP- 8
SOP-8-P
330 ± 1
F
5.5± 1
Application A
330 ±3
TO-252
F
B
62 +1.5
D
C
12.75+
0.15
D1
J
2 ± 0.5
Po
T1
12.4 ± 0.2
P1
T2
2 ± 0.2
Ao
1.55 +0.1 1.55+ 0.25 4.0 ± 0.1 2.0 ± 0.1 6.4 ± 0.1
B
100 ± 2
D
C
13 ± 0. 5
D1
J
2 ± 0.5
Po
T1
16.4 + 0.3
-0.2
P1
T2
2.5± 0.5
Ao
W
12± 0. 3
Bo
5.2± 0. 1
W
16+ 0.3
- 0.1
Bo
P
8± 0.1
E
1.75±0.1
Ko
t
2.1± 0.1 0.3±0.013
P
E
8 ± 0.1 1.75± 0.1
Ko
t
7.5 ± 0.1
Application A
380±3
TO-263
F
1.5 +0.1
B
80 ± 2
D
1.5± 0.25 4.0 ± 0.1
C
13 ± 0. 5
J
2 ± 0.5
D1
Po
2.0 ± 0.1
T1
24 ± 4
P1
6.8 ± 0.1
T2
2± 0.3
Ao
10.4± 0.1
W
24 + 0.3
- 0.1
Bo
2.5± 0.1
P
16 ± 0.1
Ko
0.3±0.05
E
1.75± 0.1
t
11.5 ± 0.1 1.5 +0.1 1.5± 0.25 4.0 ± 0.1 2.0 ± 0.1 10.8 ± 0.1 16.1± 0.1 5.2± 0.1 0.35±0.013
(mm)
Cover Tape Dimensions
Application
SOP- 8 / SOP-8-P
TO- 252
TO- 263
Carrier Width
12
16
24
Cover Tape Width
9.3
13.3
21.3
Devices Per Reel
2500
2500
1000
CONTACT
HIPAC Semiconductor, Inc.
2540 North First Street, Suite 308
San Jose, CA 95131-1016
U.S.A.
Tel: 1-408-943-0808
Fax: 1-408-943-0878
E-Mail: info@hipacsemi.com
Copyright HIPAC Semiconductor, Inc.
20
Rev. A.8 - Oct., 2003
www.hipacsemi.com
Share Link: 