5962R9581201QCC Ver la hoja de datos (PDF) - Intersil
Número de pieza
componentes Descripción
Lista de partido
5962R9581201QCC Datasheet PDF : 3 Pages
| |||
HS-302RH, HS-302EH
Die Characteristics
DIE DIMENSIONS:
(2130µm x 1930µm x 533µm ±25.4µm)
84 x 76 x 21mils ±1mil
METALLIZATION:
Type: Al
Thickness: 12.5kÅ ±2kÅ
SUBSTRATE POTENTIAL:
Unbiased (DI)
BACKSIDE FINISH:
Silicon
PASSIVATION:
Type: Silox (SiO2)
Thickness: 8kÅ ±1kÅ
WORST CASE CURRENT DENSITY:
< 2.0e5 A/cm2
TRANSISTOR COUNT:
76
PROCESS:
Metal Gate CMOS, Dielectric Isolation
Metallization Mask Layout
HS-302RH, HS-302EH
D3
D4
D1
D2
S1
S2
IN1
IN2
For additional products, see www.intersil.com/en/products.html
Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted
in the quality certifications found at www.intersil.com/en/support/qualandreliability.html
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time
without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be
accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
3
FN4603.2
April 1, 2013
Share Link: 