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SDM10K45(2010) Ver la hoja de datos (PDF) - Diodes Incorporated.

Número de pieza
componentes Descripción
fabricante
SDM10K45
(Rev.:2010)
Diodes
Diodes Incorporated. Diodes
SDM10K45 Datasheet PDF : 4 Pages
1 2 3 4
SDM10K45
SURFACE MOUNT SCHOTTKY BARRIER DIODE
Features
Fast Switching Speed
Ultra-Small Surface Mount Package
For General Purpose Switching Applications
High Conductance
Lead, Halogen and Antimony Free, RoHS Compliant "Green"
Device (Notes 3 and 4)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Case: SOD-323
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Matte Tin Finish annealed over Alloy 42 leadframe
(Lead Free Plating).Solderable per MIL-STD-202, Method 208
Polarity: Cathode Band
Marking Information: See Page 2
Ordering Information: See Page 2
Weight: 0.006 grams (approximate)
Top View
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
VRRM
Working Peak Reverse Voltage
VRWM
45
V
DC Blocking Voltage
VR
RMS Reverse Voltage
VR(RMS)
40
V
Forward Continuous Current (Note 1)
IFM
100
mA
Forward Surge Current
@ t < 8.3ms
IFSM
1.0
A
Thermal Characteristics
Characteristic
Power Dissipation (Note 1)
Thermal Resistance Junction to Ambient Air (Note 1)
Operating and Storage Temperature Range (Note 5)
Symbol
PD
RθJA
TJ, TSTG
Value
200
500
-40 to +150
Unit
mW
°C/W
°C
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic
Reverse Breakdown Voltage (Note 2)
Forward Voltage
Reverse Leakage Current (Note 2)
Total Capacitance
Symbol Min
V(BR)R
45
VF
IR
CT
Typ
370
0.07
6.0
Max
450
1.0
Unit
mV
μA
pF
Test Condition
IR = 100μA
IF = 10mA
VR = 10V
VR = 10V, f = 1.0MHz
Notes:
1. Device mounted on FR-5 PCB 1.0 x 0.75 x 0.062 inch pad layout as shown on Diodes, Inc. suggested pad layout AP02001, which can be found on our
website at http://www.diodes.com/datasheets/ap02001.pdf
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead. Halogen and Antimony Free.
4. Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date Code
V9 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
5. The heat generated must be less than the thermal conductivity from Junction-to-Ambient: dPD/dTJ < 1/RθJA
SDM10K45
Document number: DS30256 Rev. 15 - 2
1 of 4
www.diodes.com
June 2010
© Diodes Incorporated

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