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IRFE220
(Rev.:2001)

REPETITIVE AVALANCHE AND dv/dt RATED HEXFET® TRANSISTORS SURFACE MOUNT (LCC-18)

International Rectifier 

IRFE220

Electrical Characteristics @ Tj = 25°C (Unless Otherwise Specified)

Parameter

Min Typ Max Units

Test Conditions

BVDSS

Drain-to-Source Breakdown Voltage

200 — —

V

VGS = 0V, ID = 1.0mA

∆BVDSS/∆TJ Temperature Coefficient of Breakdown — 0.25 — V/°C Reference to 25°C, ID = 1.0mA

Voltage

RDS(on)

Static Drain-to-Source On-State

Resistance

— — 0.80

—

— 0.92 Ω

VGS = 10V, ID = 1.8A➃

VGS =10V, ID =2.8A ➃

VGS(th)

Gate Threshold Voltage

2.0 — 4.0 V

VDS = VGS, ID =250µA

gfs

Forward Transconductance

1.5 — — S ( )

VDS > 15V, IDS =2.8A➃

IDSS

Zero Gate Voltage Drain Current

— — 25

—

— 250 µA

VDS=160V, VGS=0V

VDS =160V

VGS = 0V, TJ = 125°C

IGSS

Gate-to-Source Leakage Forward

—

— 100 nA

IGSS

Gate-to-Source Leakage Reverse

— — -100

VGS = 20V

VGS = -20V

Qg

Total Gate Charge

— — 14.3

VGS =10V, ID= 2.8A

Qgs

Gate-to-Source Charge

— — 3.0 nC

VDS =100V

Qgd

Gate-to-Drain (‘Miller’) Charge

— — 9.0

td(on)

tr

td(off)

Turn-On Delay Time

Rise Time

Turn-Off Delay Time

— — 40

—

—

—

—

50

50

ns

VDD =100V, ID =2.8A,

RG =7.5Ω

tf

Fall Time

— — 50

LS + LD

Total Inductance

— 6.1 — nH Measured from the center of

drain pad to center of source

pad

Ciss

Input Capacitance

Coss

Output Capacitance

Crss

Reverse Transfer Capacitance

— 260

— 100 — pF

— 30 —

VGS = 0V, VDS = 25V

f = 1.0MHz

Source-Drain Diode Ratings and Characteristics

Parameter

Min Typ Max Units

IS

Continuous Source Current (Body Diode)

ISM Pulse Source Current (Body Diode) ➀

— — 2.8 A

— — 11

Test Conditions

VSD

trr

QRR

ton

Diode Forward Voltage

Reverse Recovery Time

Reverse Recovery Charge

Forward Turn-On Time

— — 1.5 V

— — 400 nS

— — 4.3 µc

Tj = 25°C, IS = 2.8A, VGS = 0V ➃

Tj = 25°C, IF =2.8A, di/dt ≤ 100A/µs

VDD ≤ 50V ➃

Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by LS + LD.

Thermal Resistance

Parameter

RthJC

RthJ-PCB

Junction to Case

Junction to PC Board

Min Typ Max Units

—

—

—

—

9.1

26"

"°"C/W

Test Conditions

Soldered to a copper clad PC board

For footnotes refer to the last page

2

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