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KBC1100-RD

Mobile KBC with Super I/O, SFI, ADC and DAC with SMSC SentinelAlert!™

SMSC -> Microchip 

Package Outline

Mobile KBC with Super I/O, SFI, ADC and DAC with SMSC SentinelAlert!TM

D

D1

3

E1/4

3

E1

D1/4

5

e

b

2

6

E

GAUGE PLANE

0.25

0°-7°

4

L

L1

DETAIL "A" (SCALE: 2/1)

A2

c6

TOP VIEW

SEE DETAIL "A"

SIDE VIEW

A1

ccc C

C

A

SEATING PLANE

3-D VIEW

A

A1

A2

D/E

D1/E1

c

L

L1

e

b

ccc

Figure 2 176-Pin TQFP Package Outline, 20X20X1.4 Body, 0.4 mm Footprint

Table 1 176-Pin TQFP Package Parameters

MIN

NOMINAL

MAX

REMARK

~

0.05

1.35

21.80

19.80

0.09

0.45

0.13

~

~

~

1.40

~

20.00

~

0.60

1.00 REF

0.40 BSC

~

~

1.60

0.15

1.45

22.20

20.20

0.20

0.75

0.23

0.08

Overall Package Height

Standoff

Body Thickness

X/Y Span

X/Y Body Size

Lead Foot Thickness

Lead Foot Length

Lead Length

Lead Pitch

Lead Width

Coplanarity

Notes:

1. All dimensions are in millimeter.

2. True position spread tolerance of each lead is ±0.035 mm at maximum material condition.

3. Dimensions D1 and E1 do not include mold protrusions. Maximum allowed protrusion is 0.25mm

per side. D1 and E1 are maximum plastic body size dimensions including mold mismatch.

4. Dimension L is measured at the gauge plane, 0.25 mm above the seating plane.

5. Details of pin 1 identifier are optional but must be located within the zone indicated.

6. Dimensions “b” and “c” apply to the flat section of the lead between 0.10mm and 0.25mm from the

lead tip.

Revision 0.8 (10-19-05)

6

PRODUCT PREVIEW

SMSC KBC1100

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