KBC1100L-PU Ver la hoja de datos (PDF) - SMSC -> Microchip
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KBC1100L-PU Datasheet PDF : 6 Pages
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Package Outline
Mobile KBC with SFI, ADC and DAC with SMSC SentinelAlert!TM
Figure 2 144 Pin VTQFP Package Outline, 20 x 20 x 1.0 Body 2mm Footprint
Table 1 144 Pin VTQFP Package Parameters
MIN
NOMINAL
MAX
REMARK
A
~
A1
0.05
A2
0.95
D
21.80
D1
19.80
E
21.80
E1
19.80
H
0.09
L
0.45
L1
~
e
q
0°
W
0.13
R1
0.08
R2
0.08
ccc
~
~
~
~
~
~
~
~
~
0.60
1.00
0.50 BSC.
~
0.18
~
~
~
1.20
0.15
1.05
22.20
20.20
22.20
20.20
0.20
0.75
~
7°
0.23
~
0.20
0.08
Overall Package Height
Standoff
Body Thickness
X Span
X Body Size
Y Span
Y Body Size
Lead Frame Thickness
Lead Foot Length
Lead Length
Lead Pitch
Lead Foot Angle
Lead Width
Lead Shoulder Radius
Lead Foot Radius
Coplanarity
Notes:
1. Controlling Unit: millimeter.
2. Tolerance on the true position of the leads is ±0.04 mm maximum.
3. Package body dimensions D1 and E1 do not include the mold protrusion.
Maximum mold protrusion is 0.25 mm.
4. Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
5. Details of pin 1 identifier are optional but must be located within the zone indicated.
Revision 0.4 (02-07-05)
6
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SMSC KBC1100L
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