LAN91C110 Ver la hoja de datos (PDF) - SMSC -> Microchip
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LAN91C110 Datasheet PDF : 56 Pages
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Chapter 8
FEAST Fast Ethernet Controller for PCMCIA and Generic 16-Bit Applications
Datasheet
Package Outline
Figure 8.1 - 144 Pin TQFP Package Outlines
Table 8.1 – 144 Pin TQFP Package Parameters
MIN
NOMINAL
MAX
A
~
1.0
1.20
A1
0.05
0.10
0.15
A2
0.95
1.00
1.05
D
21.80
22.00
22.20
D/2
10.90
11.00
11.10
D1
19.80
20.00
20.20
E
21.80
22.00
22.20
E/2
10.90
11.00
11.10
E1
19.80
20.00
20.20
H
0.09
~
0.20
L
0.45
0.60
0.75
L1
~
1.00
~
e
0.50 Basic
0o
3.5o
7o
W
0.13
0.18
0.23
R1
0.08
~
~
R2
0.08
~
0.20
ccc
~
~
0.0762
ccc
~
~
0.08
REMARK
Overall Package Height
Standoff
Body Thickness
X Span
1/2 X Span Measure from Centerline
X body Size
Y Span
1/2 Y Span Measure from Centerline
Y body Size
Lead Frame Thickness
Lead Foot Length from Centerline
Lead Length
Lead Pitch
Lead Foot Angle
Lead Width
Lead Shoulder Radius
Lead Foot Radius
Max Coplanarity (Assemblers)
Max Coplanarity (Test House)
Note 1: Controlling Unit: millimeter
Note 2: Tolerance on the position of the leads is ± 0.04 mm maximum.
Note 3: Package body dimensions D1 and E1 do not include the mold protrusion. Maximum mold protrusion Is 0.25
mm.
Note 4: Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane is 0.78-1.08 mm.
Note 5: Details of pin 1 identifier are optional but must be located within the zone indicated.
SMSC LAN91C110 Rev. B
Page 56
DATASHEET
Revision 1.0 (11-04-08)
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