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LAN8700-AEZG

±15kV ESD Protected MII/RMII Fast-Ethernet PHY with HP Auto-MDIX and SMSC flexPWR™ in a Small Footprint

SMSC -> Microchip 

±15kV ESD Protected MII/RMII Fast-Ethernet PHY with HP Auto-MDIX and SMSC flexPWRTM in a Small Footprint

Datasheet

Chapter 9 Package Outline

Figure 9.1 36-Pin QFN Package Outline, 6 x 6 x 0.90 mm Body (Lead-Free)

Table 9.1 36-Pin QFN Package Parameters

MIN

NOMINAL

MAX

A

0.80

~

1.00

A1

0

~

0.05

A2

0.60

~

0.80

A3

0.20 REF

D

5.85

~

6.15

D1

5.55

~

5.95

D2

3.55

~

3.85

E

5.85

~

6.15

E1

5.55

~

5.95

E2

3.55

~

3.85

L

0.35

~

0.75

e

0.50 Basic

b

0.18

~

0.30

ccc

~

~

0.08

REMARKS

Overall Package Height

Standoff

Mold Thickness

Copper Lead-frame Substrate

X Overall Size

X Mold Cap Size

X exposed Pad Size

Y Overall Size

Y Mold Cap Size

Y exposed Pad Size

Terminal Length

Terminal Pitch

Terminal Width

Coplanarity

Notes:

1. Controlling Unit: millimeter.

2. Dimension b applies to plated terminals and is measured between 0.15mm and 0.30mm from the

terminal tip. Tolerance on the true position of the terminal is ± 0.05 mm at maximum material

conditions (MMC).

3. Details of terminal #1 identifier are optional but must be located within the zone indicated.

4. Coplanarity zone applies to exposed pad and terminals.

SMSC LAN8700/LAN8700I

73

DATASHEET

Revision 1.0 (02-09-07)

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