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LIS331DLTR(2007) Ver la hoja de datos (PDF) - STMicroelectronics

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LIS331DLTR Datasheet PDF : 38 Pages
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LIS331DL
Mechanical and electrical specifications
2
Mechanical and electrical specifications
2.1
Mechanical characteristics
Table 2.
Symbol
Mechanical characteristics (1) (2)
Parameter
Test conditions
Min. Typ.(3) Max.
Unit
FS
Measurement range(4)
FS bit set to 0
FS bit set to 1
±2.0
±2.3
g
±8.0
±9.2
So Sensitivity
FS bit set to 0
FS bit set to 1
18
mg/digit
72
TCSO
Sensitivity change vs
temperature
FS bit set to 0
±0.01
%/°C
TyOff
Typical zero-g level offset
accuracy(5),(6)
FS bit set to 0
FS bit set to 1
±40
mg
±60
mg
TCOff
Zero-g level change vs
temperature
Max delta from 25°C
±0.5
mg/°C
FS bit set to 0
STP bit used
X axis
-11
LSb
Vst
Self test output
change(7),(8),(9)
FS bit set to 0
STP bit used
Y axis
11
LSb
BW System bandwidth(10)
FS bit set to 0
STP bit used
Z axis
-11
LSb
ODR/2
Hz
Top Operating temperature range
-40
+85
°C
Wh Product weight
20
mgram
1. All the parameters are specified @ Vdd= 2.5 V, T = 25°C unless otherwise noted
2. The product is factory calibrated at 2.5V. The operational power supply range is from 3.0V to 3.6V.
3. Typical specifications are not guaranteed
4. Verified by wafer level test and measurement of initial offset and sensitivity
5. Typical zero-g level offset value after MSL3 preconditioning
6. Offset can be eliminated by enabling the built-in high pass filter
7. If STM bit is used values change in sign for all axes
8. Self Test output changes with the power supply. Self test “output change” is defined as OUTPUT[LSb](Self-test bit on ctrl_reg1=1)
-OUTPUT[LSb](Self-test bit on ctrl_reg1=0). 1LSb=4.6g/256 at 8bit representation, ±2.3g Full-Scale
9. Output data reach 99% of final value after 3/ODR when enabling Self-Test mode due to device filtering
10. ODR is output data rate. Refer to table 3 for specifications
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