LPC47M192 Ver la hoja de datos (PDF) - SMSC -> Microchip
Número de pieza
componentes Descripción
Lista de partido
LPC47M192 Datasheet PDF : 228 Pages
| |||
7.18.3.7
7.18.3.8
7.18.3.9
7.18.3.10
7.18.3.11
7.18.3.12
Analog Voltage Measurement....................................................................................................................... 135
Voltage ID..................................................................................................................................................... 135
Temperature Measurement............................................................................................................................ 135
Thermal / Voltage Interrupt Pin .................................................................................................................... 136
Input Safety................................................................................................................................................... 137
Layout Considerations .................................................................................................................................. 137
8 RUNTIME REGISTERS ..................................................................................................................... 139
9 CONFIGURATION ............................................................................................................................. 166
9.1 SYSTEM ELEMENTS ........................................................................................................................ 166
9.1.1 Primary Configuration Address Decoder ..............................................................................................166
9.1.1.1 Entering the Configuration State ................................................................................................................... 166
9.1.1.2 Exiting the Configuration State..................................................................................................................... 166
9.2 CONFIGURATION SEQUENCE ........................................................................................................... 167
9.2.1 Enter Configuration Mode.....................................................................................................................167
9.2.1.1 Configuration Mode ...................................................................................................................................... 167
9.2.2 Exit Configuration Mode .......................................................................................................................167
9.2.2.1 Programming Example.................................................................................................................................. 167
9.3 CHIP LEVEL (GLOBAL) CONTROL/CONFIGURATION REGISTERS [0X00-0X2F]..................................... 170
9.4 LOGICAL DEVICE CONFIGURATION/CONTROL REGISTERS [0X30-0XFF]............................................. 173
9.5 SMSC DEFINED LOGICAL DEVICE CONFIGURATION REGISTERS ....................................................... 178
10 REGISTERS FOR HARDWARE MONITORING BLOCK .............................................................. 184
10.1 REGISTER SUMMARY................................................................................................................... 184
10.2 INTERNAL ADDRESS REGISTER .................................................................................................... 184
10.3 VALUE OR LIMIT REGISTERS (15H-3DH) ....................................................................................... 184
10.3.1.1 Registers 3Eh-4Fh......................................................................................................................................... 186
11 OPERATIONAL DESCRIPTION..................................................................................................... 190
11.1 MAXIMUM GUARANTEED RATINGS................................................................................................ 190
11.1.1 Super I/O section (pins 1 to 100).......................................................................................................190
11.1.2 Hardware Monitoring Block (pins 101 to 128) ...................................................................................190
11.2 HARDWARE MONITORING BLOCK SPECIFICATIONS ........................................................................ 190
11.2.1 Key Specifications.............................................................................................................................190
11.2.2 Supply Current ..................................................................................................................................190
11.2.3 Operating Temperature.....................................................................................................................190
11.2.4 Operating Voltage Ratings ................................................................................................................190
11.3 DC ELECTRICAL CHARACTERISTICS ............................................................................................. 191
11.3.1 Capacitance values for Pins..............................................................................................................196
12 TIMING DIAGRAMS ....................................................................................................................... 197
13 PACKAGE OUTLINE...................................................................................................................... 220
14 APPENDIX A – THERMAL DIODE PARAMETERS...................................................................... 221
15 APPENDIX B – ADC VOLTAGE CONVERSION........................................................................... 222
16 APPENDIX C - TEST MODE .......................................................................................................... 223
16.1 SUPER I/O BLOCK ....................................................................................................................... 223
16.1.1 Board Test Mode...............................................................................................................................223
16.2 HARDWARE MONITORING BLOCK ................................................................................................. 225
16.2.1 Board Test Mode...............................................................................................................................225
16.2.2 XNOR-Chain Test Mode ...................................................................................................................225
17 APPENDIX D - REFERENCE DOCUMENTS................................................................................. 227
18 LPC47M192 REVISIONS................................................................................................................ 228
SMSC DS – LPC47M192
Page 6
DATASHEET
Rev. 03/30/05
Share Link: 