LX1662ACN Ver la hoja de datos (PDF) - Microsemi Corporation
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LX1662ACN Datasheet PDF : 15 Pages
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PRODUCT DATABOOK 1996/1997
LX1662/62A, LX1663/63A
SINGLE-CHIP PROGRAMMABLE PWM CONTROLLERS WITH 5-BIT DAC
PRODUCTION DATA SHEET
DEVICE
LX1662
LX1662A
LX1663
LX1663A
DEVICE SELECTION GUIDE
Packages
OVP and
Current-Sense
Power Good Comp. Thresh. (mV) Optimal Load
14-pin SOIC
& DIP
No
16-pin SOIC
& DIP
Yes
100
Pentium-class (<10A)
60
Pentium II (> 10A)
100
Pentium-class (<10A)
60
Pentium II (> 10A)
A B S O L U T E M A X I M U M R AT I N G S (Note 1)
Supply Voltage (V ) .................................................................................................... 25V
C1
Supply Voltage (VCC) .................................................................................................... 15V
Output Drive Peak Current Source (500ns) ............................................................... 1.5A
Output Drive Peak Current Sink (500ns) ................................................................... 1.5A
Input Voltage (SS, INV, V , C , VID0-VID4) ........................................... -0.3V to 6V
CC_CORE T
Operating Junction Temperature
Plastic (N & D Packages) ...................................................................................... 150°C
Storage Temperature Range .................................................................... -65°C to +150°C
Lead Temperature (Soldering, 10 Seconds) ............................................................. 300°C
Peak Package Solder Reflow Temp. (40 second max. exposure)..........................................260°C (+0, -5)
Note 1. Exceeding these ratings could cause damage to the device. All voltages are with respect
to Ground. Currents are positive into, negative out of the specified terminal. Pin
numbers refer to DIL packages only.
THERMAL DATA
N PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
D PACKAGE:
65°C/W
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
120°C/W
Junction Temperature Calculation: TJ = TA + (PD x θJA).
The
θ
JA
numbers
are
guidelines
for
the
thermal
performance
of
the
device/pc-board
system.
All of the above assume no ambient airflow
PACKAGE PIN OUTS
SS 1
INV 2
VCC_CORE
3
VID0 4
VID1 5
VID2 6
VID3 7
14
VC1
13 TDRV
12 GND
11 BDRV
10
VCC
9
CT
8 VID4
N PACKAGE — 14-Pin
LX1662/1662A (Top View)
SS 1
INV 2
VCC_CORE
3
VID0 4
VID1 5
VID2 6
VID3 7
VID4 8
16
VC1
15 TDRV
14 GND
13 BDRV
12
VCC
11
CT
10 OV
9 PWRGD
N PACKAGE — 16-Pin
LX1663/1663A (Top View)
SS
INV
VCC_CORE
VID0
VID1
VID2
VID3
1 14
2
13
3
12
4
11
5
10
6
9
7
8
VC1
TDRV
GND
BDRV
VCC
CT
VID4
D PACKAGE — 14-Pin
LX1662/1662A (Top View)
SS
INV
VCC_CORE
VID0
VID1
VID2
VID3
VID4
1 16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
VC1
TDRV
GND
BDRV
VCC
CT
OV
PWRGD
D PACKAGE — 16-Pin
LX1663/1663A (Top View)
RoHS / Pb-free 100% Matte Tin Lead Finish
2
Copyright © 1999
Rev. 1.2a, 11/04
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