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LX1672(2005_08) Ver la hoja de datos (PDF) - Microsemi Corporation

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Lista de partido
LX1672
(Rev.:2005_08)
Microsemi
Microsemi Corporation Microsemi
LX1672 Datasheet PDF : 20 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
LX1672
®
Multiple Output LoadSHARE™ PWM
TM
PRODUCTION DATA SHEET
ABSOLUTE MAXIMUM RATINGS
Supply Voltage (VCC) DC .................................................................-0.3V to 5.5V
Driver Supply Voltage (VCx, VCCL) DC ............................................-0.3V to 12V
Current Sense Inputs (VSX, CSX) ....................................................... -0.3V to 12V
Error Amplifier Inputs (FBX, RF2, LDFB)........................................-0.3V to 5.5V
Input Voltage (SS / Enable, LDDIS) .................................................-0.3V to5.5V
Output Drive Peak Current Source (HOx, LOx)....................................1A (500ns)
Output Drive Peak Current Sink (HOx, LOx) .......................................1A (500ns)
Operating Junction Temperature.................................................................. 150°C
Storage Temperature Range...........................................................-65°C to 150°C
Peak Package Solder Reflow Temp.(40 second max. exposure) .... 260°C (+0, -5)
Note: Exceeding these ratings could cause damage to the device. All voltages are with
respect to Ground. Currents are positive into, negative out of specified
terminal.
x= Denote Phases 1 & 2
THERMAL DATA
PW Plastic TSSOP 28-Pin
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
85°C/W
LQ Plastic MLPQ 38-Pin
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
35°C/W
Junction Temperature Calculation: TJ = TA + (PD x θJC).
The θJA numbers are guidelines for the thermal performance of the device/pc-board system.
All of the above assume no ambient airflow.
PACKAGE PIN OUT
HO2
LO2
PG2
LDGD
LDFB
LDDIS
DGND
AGND
DIS2
SS2
RF2
FB2
EO2
CS2
1
28
2
27
3
26
4
25
5
24
6
23
7
22
8
21
9
20
10
19
11
18
12
17
13
16
14
15
PW PACKAGE
(Top View)
VC2
VC1
HO1
LO1
PG1
VCCL
VCC
VS1
CS1
EO1
FB1
SS1
DIS1
VS2
HO2
VC2
LDGD
LDFB
LDDIS
DGND
AGND
RSVD
SS2
RF2
FB2
EO2
1 38 37 36 35 34 33 32 31
2
30
3
29
4
28
5
27
6 Connect Bottom to 26
Power GND
7
25
8
24
9
23
10
22
11
21
12 13 14 15 16 17 18 19 20
N.C.
N.C.
VCCL
VCC
DIS2
DIS1
N.C.
N.C.
PWGD
N.C.
N.C.
N.C.
(N.C. – No Internal Connection
N/U – Not Used)
RoHS / Pb-free 100% Matte Tin Lead Finish
Copyright © 2000
Rev. 1.0, 2005-08-10
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 2

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