MAX2395 Ver la hoja de datos (PDF) - Maxim Integrated
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MAX2395 Datasheet PDF : 13 Pages
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WCDMA Quasi-Direct Modulator
with VGA and PA Driver
SDATA
BIT 15 BIT 14
BIT 5 BIT 4
A1 A0
SCLK
CS
tCWH
tCWL
tCS
tCH
tES
Figure 1. 3-Wire SPI/MICROWIRE Serial-Interface Timing Diagram
MSB
20-BIT REGISTER
LSB
DATA 16 BITS
ADDRESS 4 BITS
B15 B14 B13 B12 B11 B10 B9
B8
B7
B6
B5
B4
B3
B2
B1
B0
A3
A2
A1
A0
RFM DIVIDE RATIO REGISTER (16 BITS)
ADDRESS
B15 B14 B13 B12 B11 B10
B9
B8
B7
B6
B5
B4
B3
B2
B1
B0
0
0
1
0
RFR DIVIDE RATIO REGISTER (9 BITS)
ADDRESS
B15 B14 B13 B12 B11 B10
B9
B8 B7
B6
B5
B4
B3
B2
B1
B0
0
0
0
0
OPERATION CONTROL REGISTER (16 BITS)
ADDRESS
B15 B14 B13 B12 B11 B10 B9
B8
B7
B6
B5
B4
B3
B2
B1
B0
0
1
0
0
Figure 2. Register Assignments
It is recommended that the exposed pad be soldered
to a ground plane on the PCB, either directly or through
an array of plated via holes. Soldering the pad to
ground is critical for proper heat dissipation. Use a
solid ground plane wherever possible. Any cutout in the
ground plane may act as a slot radiator and reduce its
shield effectiveness.
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