MAX3967 Ver la hoja de datos (PDF) - Maxim Integrated
Número de pieza
componentes Descripción
Lista de partido
MAX3967 Datasheet PDF : 14 Pages
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270Mbps SFP LED Driver
PECL
OUTPUT
Input Terminations
50Ω
VCC - 2V
VCC
MAX3967
IN+
Exposed-Pad Package
The exposed pad on the 24-pin QFN provides a very
low thermal resistance path for heat removal from
the IC.
Chip Information
TRANSISTOR COUNT: 327
SUBSTRATE CONNECTED TO VEE
PROCESS: BIPOLAR
DIE THICKNESS: 15 mils
RF OR NON-PECL
OUTPUT
VCC R1 R2
3.3 82 130
5.0 68 180
R1
MAX3967
IN+
R2
SINGLE-ENDED TERMINATION IS SHOWN. IN- SHOULD BE TERMINATED SIMILARLY.
Figure 3. Input Terminations
Applications Information
Wire-Bonding Die
The MAX3967 utilizes gold metalization, which provides
high reliability. Make connections to the die with gold
wire only, using ball-bonding techniques. Use caution if
attempting wedge-bonding. Pad size is 4 mils x 4 mils
(100µm). Die thickness is typically 15 mils (375µm).
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