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MC06XSD200FK

Dual 6.0 mOhm High Side Switch

Freescale Semiconductor 

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

Table 2. Maximum Ratings (continued)

All voltages are relative to ground unless mentioned otherwise. Exceeding these ratings may cause permanent damage.

Parameter

Symbol

Maximum ratings

Unit

THERMAL RATINGS

Operating Temperature (8)

C

Ambient

Junction

TA

- 40 to 125

TJ

- 40 to 150

Storage Temperature

TSTG

- 55 to 150

C

Thermal Resistance / Junction to Case

Reflow Peak Temperature on device pins during soldering(9), (10)

RJC

TSOLDER

<1.0

260

C/ W

C

Notes:

8. To achieve high reliability over 10 years of continuous operation, the device's continuous operating junction temperature should not

exceed 125 C.

9. 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent

damage to the device. MSL level is specified later.

10. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020. For Peak Package Reflow

Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes

and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.

Analog Integrated Circuit Device Data

Freescale Semiconductor

06XSD200

7

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