ML7029 Ver la hoja de datos (PDF) - Oki Electric Industry

Número de pieza

componentes Descripción

Lista de partido

ML7029

Multifunction ADPCM CODEC

Oki Electric Industry 

OKI Semiconductor

PACKAGE DIMENSIONS

SSOP30-P-56-0.65-K

Mirror finish

FEDL7029-03

ML7029

(Unit: mm)

5

Package material

Lead frame material

Pin treatment

Package weight (g)

Rev. No./Last Revised

Epoxy resin

42 alloy

Solder plating (≥5µm)

0.19 TYP.

5/Dec. 5, 1996

Notes for Mounting the Surface Mount Type Package

The surface mount type packages are very susceptible to heat in reflow mounting and humidity

absorbed in storage.

Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product

name, package name, pin number, package code and desired mounting conditions (reflow method,

temperature and times).

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