MM74HC595 Ver la hoja de datos (PDF) - Fairchild Semiconductor
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MM74HC595 Datasheet PDF : 14 Pages
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Physical Dimensions
10.00
9.80
8.89
16
A
9
B
1.75
6.00
4.00
3.80
5.6
PIN ONE
INDICATOR
1
1.27
(0.30)
8
0.51
0.35
0.25 M C B A
1.27
0.65
LAND PATTERN RECOMMENDATION
1.75 MAX
1.50
1.25
0.25
0.10
C
0.10 C
SEE DETAIL A
0.25
0.19
(R0.10)
(R0.10)
8°
0°
0.90
0.50
(1.04)
0.50
0.25
X 45°
GAGE PLANE
0.36
SEATING PLANE
NOTES: UNLESS OTHERWISE SPECIFIED
A) THIS PACKAGE CONFORMS TO JEDEC
MS-012, VARIATION AC, ISSUE C.
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS ARE EXCLUSIVE OF BURRS, MOLD
FLASH AND TIE BAR PROTRUSIONS
D) CONFORMS TO ASME Y14.5M-1994
E) LANDPATTERN STANDARD: SOIC127P600X175-16AM
F) DRAWING FILE NAME: M16AREV12.
DETAIL A
SCALE: 2:1
Figure 4. 16-Lead, Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150 Inch Narrow
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the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 1983 Fairchild Semiconductor Corporation
MM74HC595 • Rev. 1.0.2
10
www.fairchildsemi.com
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