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MM908E624

Integrated Triple High Side Switch with Embedded MCU and LIN Serial Communication for Relay Drivers

Freescale Semiconductor 

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

Table 2. Maximum Ratings (continued)

All voltages are with respect to ground unless otherwise noted. Exceeding limits on any terminal may cause permanent

damage to the device.

Rating

Symbol

Value

Unit

THERMAL RATINGS

Package Operating Ambient Temperature (4)

MM908E624ACDWB and MM908E624ACEW

MM908E624AYEW

Operating Junction Temperature (2)(4)

MM908E624ACDWB and MM908E624ACEW

MM908E624AYEW

TA

°C

- 40 to 85

- 40 to 125

TJ

°C

- 40 to 125

- 40 to 125

Storage Temperature

Peak Package Reflow Temperature During Reflow(3)(5)

TSTG

TPPRT

- 40 to 150

°C

Note 5

°C

Notes

2. The temperature of analog and MCU die is strongly linked via the package, but can differ in dynamic load conditions, usually because

of higher power dissipation of the analog die. The analog die junction temperature must not exceed 150°C under these conditions.

3. Terminal soldering temperature is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may

cause malfunction or permanent damage to the device.

4. Independent of TA, device parametrics are only guaranteed for -40 < TJ < 125°C. Please see note 2. TJ is a factor of power dissipation,

package thermal resistance, and available heat sinking.

5. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow

Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes

and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.

908E624

6

Analog Integrated Circuit Device Data

Freescale Semiconductor

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