MV2101 Ver la hoja de datos (PDF) - ON Semiconductor

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componentes Descripción

Lista de partido

MV2101

Silicon Tuning Diode

ON Semiconductor 

MMBV2101LT1 Series, MV2105, MV2101, MV2109, LV2209

PACKAGE DIMENSIONS

SOT−23 (TO−236)

CASE 318−08

ISSUE AN

D

SEE VIEW C

3

E

HE

1

2

b

e

A

A1

c

0.25

q

L

L1

VIEW C

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD

FINISH THICKNESS. MINIMUM LEAD

THICKNESS IS THE MINIMUM THICKNESS OF

BASE MATERIAL.

4. 318−01 THRU −07 AND −09 OBSOLETE, NEW

STANDARD 318−08.

MILLIMETERS

DIM MIN NOM MAX

A 0.89

1.00

1.11

A1 0.01

0.06

0.10

b 0.37

0.44

0.50

c

0.09

0.13

0.18

D 2.80

2.90

3.04

E 1.20

1.30

1.40

e

1.78

1.90

2.04

L 0.10

0.20

0.30

L1 0.35

0.54

0.69

H E 2.10

2.40

2.64

STYLE 8:

PIN 1. ANODE

2. NO CONNECTION

3. CATHODE

MIN

0.035

0.001

0.015

0.003

0.110

0.047

0.070

0.004

0.014

0.083

INCHES

NOM

0.040

0.002

0.018

0.005

0.114

0.051

0.075

0.008

0.021

0.094

MAX

0.044

0.004

0.020

0.007

0.120

0.055

0.081

0.012

0.029

0.104

SOLDERING FOOTPRINT*

0.95

0.037

0.95

0.037

2.0

0.079

0.9

0.035

0.8

0.031

ǒ Ǔ SCALE 10:1

mm

inches

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

http://onsemi.com

4

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