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MPVZ5150

Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated

Freescale Semiconductor 

Pressure

PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE

Freescale designates the two sides of the pressure sensor

as the Pressure (P1) side and the Vacuum (P2) side. The

Pressure (P1) side is the side containing fluorosilicone gel

which protects the die from harsh media. The MPX pressure

sensor is designed to operate with positive differential

pressure applied, P1 > P2.

The Pressure (P1) side may be identified by using the

table below:

MPVZ5150GC6T1

MPVZ5150GC7U

Part Number

Case Type

482A

482C

Pressure (P1) Side Identifier

Side with Port Attached

Side with Port Attached

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total

design. The footprint for the surface mount packages must be

the correct size to ensure proper solder connection interface

between the board and the package. With the correct

footprint, the packages will self align when subjected to a

solder reflow process. It is always recommended to design

boards with a solder mask layer to avoid bridging and

shorting between solder.

Figure 5. Small Outline Package Footprint

MPVZ5150

6

Sensors

Freescale Semiconductor

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