MPVZ7025G6T1 Ver la hoja de datos (PDF) - Freescale Semiconductor

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MPVZ7025G6T1

Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated

Freescale Semiconductor 

PACKAGE DIMENSIONS

Pressure

2 PLACES 4 TIPS

0.008 (0.20) C A B

A

E

e

5

4

e/2

D

GAGE

PLANE

.014 (0.35)

θ

L

A1

DETAIL G

8

F

1

8X b

0.004 (0.1) M C A B

B

E1

∅T

N

K

A

M

8X 0.004 (0.1)

P

DETAIL G

C

SEATING

PLANE

NOTES:

1. CONTROLLING DIMENSION: INCH.

2. INTERPRET DIMENSIONS AND TOLERANCES PER

ASME Y14.5M, 1994.

3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE

MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR

PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152)

PER SIDE.

4. DIMENSION "b" DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM.

INCHES MILLIMETERS

DIM MIN MAX MIN MAX

A 0.300 0.330 7.11 7.62

A1 0.002 0.010 0.05 0.25

b 0.038 0.042 0.96 1.07

D 0.465 0.485 11.81 12.32

E 0.717 BSC

18.21 BSC

E1 0.465 0.485 11.81 12.32

e 0.100 BSC

2.54 BSC

F 0.245 0.255 6.22 6.47

K 0.120 0.130 3.05 3.30

L 0.061 0.071 1.55 1.80

M 0.270 0.290 6.86 7.36

N 0.080 0.090 2.03 2.28

P 0.009 0.011 0.23 0.28

T 0.115 0.125 2.92 3.17

θ 0˚

7˚

0˚

7˚

CASE 1369-01

ISSUE O

SMALL OUTLINE PACKAGE

Sensors

Freescale Semiconductor

MPXV7025

9

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