MSM7542 Ver la hoja de datos (PDF) - Oki Electric Industry
Número de pieza
componentes Descripción
Lista de partido
MSM7542 Datasheet PDF : 20 Pages
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¡ Semiconductor
PACKAGE DIMENSIONS
DIP20-P-300-2.54-S1
MSM7541/7542
(Unit : mm)
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
1.49 TYP.
18/20
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