MSM7590L-01 Ver la hoja de datos (PDF) - Oki Electric Industry

Número de pieza

componentes Descripción

Lista de partido

MSM7590L-01

Multi-Function ADPCM CODEC

Oki Electric Industry 

¡ Semiconductor

PACKAGE DIMENSIONS

TSOPI32-P-814-0.50-1K

Mirror finish

MSM7590L-01

(Unit : mm)

Notes for Mounting the Surface Mount Type Package

Package material

Lead frame material

Pin treatment

Solder plate thickness

Package weight (g)

Epoxy resin

42 alloy

Solder plating

5 mm or more

0.27 TYP.

The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which

are very susceptible to heat in reflow mounting and humidity absorbed in storage.

Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the

product name, package name, pin number, package code and desired mounting conditions

(reflow method, temperature and times).

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