NCP360, NCV360
In every case, we recommend to make thermal
measurement on final application board to make sure of the
final Thermal Resistance.
380
50%
45%
330
40%
TSOP−5 1.0 oz
TSOP−5 2.0 oz
280
DFN 2x2.2 1.0 oz
DFN 2x2.2 2.0 oz
35%
% Delta DFN vs TSOP−5
30%
230
25%
20%
180
15%
130
80
0
10%
5%
0%
100
200
300
400
500
600
700
Copper heat spreader area (mm^2)
Figure 20. Thermal Resistance of UDFN 2x2 and TSOP Packages as a Function of PCB Area and Thickness
http://onsemi.com
10